FineSAT (ultrasound imaging equipment)

FineSAT is a device that uses the reflection and transmission characteristics of ultrasonic waves to nondestructively detect and image fine structures and defects inside semiconductors and electronic components.
Fields of application include semiconductor packaging (IC substrates, etc.), electronic components and ceramics (MLCCs, etc.), resins / plastics and composite materials, power modules (automotive semiconductors, IGBTs, etc.), metal parts and target materials, and MEMS. FineSAT enables the detection of defects such as voids, cracks, and peeling in each product that cannot be detected by X-ray equipment, infrared inspection equipment, or optical microscopes.
Manufacturer: Hitachi Power Solutions Co., Ltd.